Zeynep Toprak
Swiss Federal
Institute of Technology (EPFL-Lausanne)
Microelectronic
Systems Laboratory
Date: 2:00pm, Friday, December 8, 2006
Place: Interschool lab - 7th floor - CEPSR
Title: Multi-Unit
Global Energy Management and Optimization for Network-on-Chip Applications
The problem of
energy optimization in multi-core systems (such as single-chip
multiprocessors) where the individual energy demands of various
processing elements are governed by instantaneous workload requirements
is well defined in literature. The significance of the problem is
underlined by the increasing prominence of multi-core systems that must
operate under strict power/energy budget constraints, both in mobile
applications and in cases where special cooling arrangements can be
very expensive. A range of solutions have been proposed over the last
few years, which are mostly based on static, off-line calculation of a
limited set of operating points in the form of optimum voltage and
frequency assignments, that are subsequently chosen according to actual
demands. Still, to our best knowledge, none of these studies have
demonstrated an on-line solution to complex, multi-variable energy
optimization problem which allows dynamic adjustment of individual
operating frequencies and supply voltages of multiple processing
elements. This work presents the design and silicon implementation of
an analog-based energy optimizer unit, which is capable of dynamically
adjusting power supply and clock frequencies of multiple embedded
cores, tailored to the instantaneous workload information
(computational task) and fully adaptive to variations in process and
temperature.
Our approach
borrows from the basic principles of analog computation to continuously
optimize the system-wide energy dissipation of multiple processing
elements, converging on the global minima of the constrained
optimization problem which are represented as stable operating points
of a simple feedback loop. It is already well known that stable,
approximate solutions of multi- variable optimization problems (such as
gradient descent) can be obtained by using very compact analog
circuits, e.g. resistive networks. The analogy between the energy
minimization problem under timing constraints in a general task graph
and the power minimization problem under Kirchhoff's current law
constraints in an equivalent resistive network is exploited. The
implementation of the on-line analog optimizer is then discussed. The
realization of the blocks composing the system architecture is
described, and circuit design issues are studied thoroughly.
Dr. Yorgos Palaskas
Communications Technology Lab
Intel Corporation, Hillsboro, OR
Date: 2:00pm, Friday, December 1, 2006
Place: Interschool lab - 7th floor - CEPSR
Title: High data rate wireless communications using CMOS
Abstract:
This
talk presents wireless technologies that can achieve high data rates
(0.1-5 Gb/s) and are amenable to CMOS integration. The first
technology discussed uses multiple antennas (MIMO) and spatial
multiplexing to obtain high data rates by re-using a limited RF
bandwidth. In spatial multiplexing MIMO, independent data streams are
transmitted from the different transmit antennas. These data streams
merge in the wireless channel but the receiver can still separate
them by using advanced DSP techniques. The talk discusses the
implications of MIMO processing to the RFIC design. It is shown that
crosstalk between the multiple transceivers residing on the same die
can degrade the MIMO performance and has to be carefully minimized,
especially when power amplifiers are integrated on-die. A 5GHz 2x2
MIMO prototype has been fabricated and tested to demonstrate these
ideas. The transceiver includes linearized integrated power
amplifiers that deliver a 1-dB compression point power of 20.5dBm.
The MIMO transceiver achieves a data rate of 108Mb/s, which is double
what conventional single-antenna WLAN technology can achieve within
the same RF bandwidth, demonstrating the spectral efficiency
advantage of MIMO spatial multiplexing. Even higher data rates can
be achieved by using abundant, underutilized RF bandwidth available
at mm-wave frequencies (e.g. 60GHz). Wireless communications at
mm-wave frequencies present severe challenges due to increased path
loss, deteriorating transistor performance, and packaging
complications. These issues might be offset by the large RF
bandwidths available and the small antenna size that might allow the
deployment of antenna arrays to help restore the performance of the
overall system. The challenges and opportunities of mm-wave
transceivers are reviewed and some first experimental results are
reported.
Dr. Scott Reynolds
IBM Thomas J. Watson Research Center
Date: 2:00pm, Friday, September 29, 2006
Place: EE Conference Room 1312 Mudd
Title: From Transmission Lines to Transceivers: Silicon
Millimeter-Wave ICs for 60GHz and Beyond
Abstract:
A 0.13-um SiGe
BiCMOS double-conversion superheterodyne receiver and transmitter
chipset for data communications in the 60-GHz band is presented. The
receiver chip includes an image-reject LNA, RF-to-IF mixer, IF
amplifier strip, quadrature IF-to-baseband mixers, PLL, and frequency
tripler. It achieves a 6-dB NF, -30 dBm IIP3, and consumes 500 mW. The
transmitter chip includes a PA, image-reject driver, IF-to-RF upmixer,
IF amplifier strip, quadrature baseband-to-IF mixers, PLL, and
frequency tripler. It achieves output P1dB of 10 to 12 dBm, Psat of 15
to 17 dBm, and consumes 800 mW. The chips have been packaged with
planar antennas, and a wireless data link at 630 Mb/s and 10 m has been
demonstrated. Wireless transmission of un-compressed high-definition
digital video at 2 Gb/s has also recently been achieved.
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